Course: Sputter Deposition
Course Objectives
- Understand target effects and sputtered atoms.
- Learn about magnetron, diode, triode, and ion beam systems.
- Learn about DC and RF systems for targets and substrates.
- Understand reactive sputtering.
- Understand film properties and learn system parameters.
Course Description
Films are deposited by sputtering for their useful properties in microelectronics, surface protection, optics, etc., by a variety of sputtering techniques. The film properties depend on the parameters of the sputtering system, such as pressure and substrate bias.This course provides an understanding of the cause and effect of changes in sputtering parameters on the energetics of the sputtering and deposition processes and their relationship to film properties. The energy and distribution of species ejected from the target are discussed. The effect of the sputtering system on material transport to the substrate and subsequent film deposition is also discussed for films of metals, alloys, and compounds. The parameters of different sputtering systems (diode, triode, magnetron, and ion guns) with DC and RF power supplies are discussed with respect to film properties.
Who Should Attend?
Scientists, technicians, and others involved in the deposition of thin films by sputtering who want to understand the effects of operating parameters on the properties of metal, alloy, and dielectric films.Instructor:
Joe Greene, Professor of Materials Science and Head of Electronics Materials Division, University of IllinoisCourse Materials:
Course NotesCost: $850
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